Semiconductor device structure and method for forming the same

ABSTRACT

A semiconductor device structure is provided. The semiconductor device structure includes a substrate, a first fin structure over the substrate, and a FeFET device over a first region of the substrate. The FeFET includes a first gate stack across the first fin structure. The semiconductor device structure also includes first gate spacer layers alongside the first gate stack, and a ferroelectric layer over the first gate stack. At least a portion of the ferroelectric layer is located between upper portions of the first gate spacer layers and is adjacent to the first gate stack.

BACKGROUND

Many modern-day electronic devices contain an electronic memoryconfigured to store data. This electronic memory may be a volatilememory or a non-volatile memory. Volatile memory stores data while it ispowered, while non-volatile memory is able to store data when power isremoved. Ferroelectric random-access memory (FRAM) devices are apromising candidate for next-generation non-volatile memory technology.This is because FRAM devices have many advantages, including a fastwrite time, high endurance, low power consumption, and lowsusceptibility to damage from radiation. In addition, decoupledferroelectric material allows increasing fields to pass through theferroelectric material so that the FRAM devices may become potentialapplications in an advanced node. However, it can be difficult tointegrate the fabrication of a FRAM device into a complementarymetal-oxide-semiconductor (CMOS) process. While the current methods havebeen satisfactory in many respects, continued improvements are stillneeded.

BRIEF DESCRIPTION OF THE DRAWINGS

Aspects of the present disclosure are best understood from the followingdetailed description when read with the accompanying figures. It shouldbe noted that, in accordance with the standard practice in the industry,various features are not drawn to scale. In fact, the dimensions of thevarious features may be arbitrarily increased or reduced for clarity ofdiscussion.

FIG. 1 is a perspective view of a semiconductor device structure withFinFET design, in accordance with some embodiments of the disclosure.

FIGS. 2A-1 through 2L-2 are cross-sectional views illustrating theformation of a semiconductor device structure with FinFET design atvarious intermediate stages, in accordance with some embodiments of thedisclosure.

FIG. 3 is a flowchart of a method for forming a semiconductor devicestructure, in accordance with some embodiments of the disclosure.

FIGS. 4-1 and 4-2 are cross-sectional views of a semiconductor devicestructure with FinFET design, in accordance with some embodiments of thedisclosure.

FIGS. 5A and 5B are cross-sectional views illustrating the formation ofa semiconductor device structure with FinFET design at variousintermediate stages, in accordance with some embodiments of thedisclosure.

FIGS. 6A-1 through 6D-2 are cross-sectional views illustrating theformation of a semiconductor device structure with FinFET design atvarious intermediate stages, in accordance with some embodiments of thedisclosure.

FIGS. 7A-1 through 7B-2 are cross-sectional views illustrating theformation of a semiconductor device structure with FinFET design atvarious intermediate stages, in accordance with some embodiments of thedisclosure.

FIG. 8 is a perspective view of a semiconductor device structure withgate-all-around (GAA) design, in accordance with some embodiments of thedisclosure.

FIGS. 9A-1 through 9D-2 are cross-sectional views illustrating theformation of a semiconductor device structure with GAA design at variousintermediate stages, in accordance with some embodiments of thedisclosure.

FIGS. 10-1 and 10-2 are cross-sectional view a of a semiconductor devicestructure with GAA design, in accordance with some embodiments of thedisclosure.

FIG. 11 is a cross-sectional view of a semiconductor device structurewith GAA design, in accordance with some embodiments of the disclosure.

FIGS. 12-1 and 12-2 are cross-sectional views of a semiconductor devicestructure with GAA design, in accordance with some embodiments of thedisclosure.

FIGS. 13-1 and 13-2 are cross-sectional views of a semiconductor devicestructure with GAA design, in accordance with some embodiments of thedisclosure.

FIGS. 14A-1 through 14B-2 are cross-sectional views illustrating theformation of a semiconductor device structure at various intermediatestages with GAA design, in accordance with some embodiments of thedisclosure.

DETAILED DESCRIPTION

The following disclosure provides many different embodiments, orexamples, for implementing different features of the subject matterprovided. Specific examples of components and arrangements are describedbelow to simplify the present disclosure. These are, of course, merelyexamples and are not intended to be limiting. For example, the formationof a first feature over or on a second feature in the description thatfollows may include embodiments in which the first and second featuresare formed in direct contact, and may also include embodiments in whichadditional features may be formed between the first and second features,such that the first and second features may not be in direct contact. Inaddition, the present disclosure may repeat reference numerals and/orletters in the various examples. This repetition is for the purpose ofsimplicity and clarity and does not in itself dictate a relationshipbetween the various embodiments and/or configurations discussed.

Some variations of the embodiments are described. Throughout the variousviews and illustrative embodiments, like reference numerals are used todesignate like elements. It should be understood that additionaloperations can be provided before, during, and after the method, andsome of the operations described can be replaced or eliminated for otherembodiments of the method.

Furthermore, when a number or a range of numbers is described with“about,” “approximate,” and the like, the term is intended to encompassnumbers that are within a reasonable range including the numberdescribed, such as within +/−10% of the number described or other valuesas understood by person skilled in the art. For example, the term “about5 nm” encompasses the dimension range from 4.5 nm to 5.5 nm.

Fin structures described below may be patterned by any suitable method.For example, the fins may be patterned using one or more lithographyprocesses, including double-patterning or multi-patterning processes.Generally, double-patterning or multi-patterning processes combinelithography and self-aligned processes, allowing patterns to be createdthat have, for example, pitches smaller than what is otherwiseobtainable using a single, direct lithography process. For example, inone embodiment, a sacrificial layer is formed over a substrate andpatterned using a lithography process. Spacers are formed alongside thepatterned sacrificial layer using a self-aligned process. Thesacrificial layer is then removed, and the remaining spacers may then beused to pattern the fins.

The present disclosure, in some embodiments, relates to a semiconductordevice structure having a ferroelectric random access memory (FeFET)device with fin field effect transistor (FinFET) design orgate-all-around (GAA) design. The FeFET may be integrated intocomplementary metal-oxide-semiconductor (CMOS) manufacturing processes.In specific, a capacitor of the FeFET may be fabricated in CMOSmiddle-end off line (MEOL) processes. MEOL generally encompassesprocesses related to fabricating contact plugs and/or vias to conductivefeatures (e.g., gate stacks and/or the source/drain features) of thedevice (e.g., transistors). Embodiments of a semiconductor devicestructure including a FeFET device and a method for forming the same areprovided. The FeFET may have capacitor above transistor (CAT) design inwhich a capacitor of the FeFET device is formed directly above and inelectrical connected to a gate stack of a transistor. The method forforming the FeFET device includes recessing the gate stack to form arecess and forming a ferroelectric layer in the recess. Therefore, theendurance and the retention of the FeFET device may be enhanced, thepower consumption the FeFET device may be lowered, and a fabricationprocess for forming the FeFET device may be achieved.

FIG. 1 is a perspective view of a semiconductor device structure 11 withFinFET design, in accordance with some embodiments of the disclosure. asemiconductor device structure 11 is provided, as shown in FIG. 1, inaccordance with some embodiments. The semiconductor device structure 11includes a substrate 102, in accordance with some embodiments. For abetter understanding of the semiconductor device structure, FIG. 1illustrates an X-Y-Z coordinate reference that is used in later figures.The X-axis and Y-axis are generally orientated along the lateraldirections that are parallel to the main surface of the substrate 102.The Y-axis is transverse (e.g., substantially perpendicular) to theX-axis. The Z-axis is generally oriented along the vertical directionthat is perpendicular to the main surface of the substrate 102 (or theX-Y plane).

In some embodiments, the substrate 102 is a silicon substrate. In someembodiments, the substrate 102 includes an elementary semiconductor suchas germanium; a compound semiconductor such as gallium nitride (GaN),silicon carbide (SiC), gallium arsenide (GaAs), gallium phosphide (GaP),indium phosphide (InP), indium arsenide (InAs), and/or indium antimonide(InSb); an alloy semiconductor such as SiGe, GaAsP, AlInAs, AlGaAs,GaInAs, GaInP, and/or GaInAsP; or a combination thereof. Furthermore,the substrate 102 may optionally include an epitaxial layer (epi-layer),may be strained for performance enhancement, may include asilicon-on-insulator (SOI) structure, and/or have other suitableenhancement features.

The substrate 102 may include various device regions, e.g., a logicregion, a volatile memory region (e.g., static random access memory(SRAM) region), a non-volatile memory region (e.g., an FRAM region), ananalog region, a peripheral region (e.g., input/output region), anothersuitable region, or a combination thereof. In some embodiments, thesubstrate 102 includes a first region 102A where logic devices and/orSRAM devices are to be formed and a second region 102A whereferroelectric field effect transistor (FeFET) devices are to be formed,as shown in FIG. 1, in accordance with some embodiments.

A first fin structure 104A is formed over the first region 102A of thesubstrate 102 and a second fin structure 104B is formed over the secondregion 102B of the substrate 102, in accordance with some embodiments.For example, the first fin structure 104A may be used to form logicdevices and/or SRAM devices, and the second fin structure 104B may beused to form FeFET devices.

The fin structures 104A and 104B extend in the X direction, inaccordance with some embodiments. That is, the fin structures 104A and104B each have a longitudinal axis parallel to X direction, inaccordance with some embodiments. X direction may also be referred to asthe channel-extending direction. Each of the fin structures 104A and104B includes a channel region CH and source/drain regions SD, where thechannel region CH is defined between the source/drain regions SD, inaccordance with some embodiments. FIG. 1 shows one channel region CH andtwo source/drain regions SD for illustrative purpose and is not intendedto be limiting. The number of the channel region CH and the source/drainregion SD may be dependent on design demand and/or performanceconsideration of the semiconductor device structure 11. Final gatestacks (not shown) will be formed with a longitudinal axis parallel to Ydirection and extending across the channel regions CH of the finstructures 104A and 104B. Y direction may also be referred to as agate-extending direction.

In some embodiments, the formation of the fin structures 104A and 104Bincludes patterning the substrate 102. In some embodiments, thepatterning process includes forming a patterned mask layer (not shown)over the substrate 102, and etching the substrate 102 uncovered by thepatterned mask layer, thereby forming trenches and the fin structures104A and 104B protruding between from the trenches. The patterned masklayer may be a patterned photoresist layer and/or a patterned hard mask.The etching process may be an anisotropic etching process, e.g., dryetching. The fin structures 104A and 104B are active regions of thesemiconductor device structure 11, which are to be formed into channelregions and source/drain regions of transistors, e.g., FinFETs, inaccordance with some embodiments.

FIG. 1 further illustrates a reference cross-section that is used inlater figures. Cross-sections X-X are in plans along the longitudinalaxes of the fin structure 104A and 104B, in accordance with someembodiments. Cross-section Y-Y is in a plane across the channel regionCH of the fin structures 104A and 104B and is along the longitudinalaxis of a gate stack, in accordance with some embodiments.

FIGS. 2A-1 through 2L-2 are cross-sectional views illustrating theformation of a semiconductor device structure 11 with FinFET design atvarious intermediate stages, in accordance with some embodiments of thedisclosure. FIGS. 2A-1, 2B-1, 2C-1, 2D-1, 2E-1, 2F-1, 2G-1, 2H-1, 2I-1,2J-1, 2K-1 and 2L-1 are cross-sectional views corresponding tocross-section X-X of FIG. 1 and FIGS. 2A-2, 2B-2, 2C-2, 2D-2, 2E-2,2F-2, 2G-2, 2H-2, 2I-2, 2J-2, 2K-2 and 2L-2 are cross-sectional viewscorresponding to cross-section Y-Y of FIG. 1.

FIGS. 2A-1 and 2A-2 are cross-sectional views of a semiconductor devicestructure 11 after the formation of an isolation feature 106, dummy gatestructures 108A and 108B, gate spacer layers 113, source/drain features114A and 114B, and a lower interlayer dielectric (ILD) layer 116, inaccordance with some embodiments. An isolation feature 106 is formedover the substrate 102 and surrounds lower portions of the finstructures 104A and 104B, as shown in FIGS. 2A-1 and 2A-2, in accordancewith some embodiments. The isolation features 106 is configured toelectrically isolate the active regions, e.g., fin structures 104A and104B and is also referred to as shallow trench isolation (STI) feature,in accordance with some embodiments.

In some embodiments, the isolation feature 106 is made of an insulatingmaterial such as silicon oxide, silicon nitride, silicon oxynitride(SiON), another suitable insulating material, multilayers thereof,and/or a combination thereof. In some embodiments, the formation of theisolation feature 106 includes depositing one or more insulatingmaterials for the isolation feature 106 over the semiconductor devicestructure 11 to fill the trenches, planarizing the insulating materialto remove portions of the insulating material above the upper surfacesof the fin structures 104A and 104B, and recessing the insulatingmaterial using an etching process, thereby exposing upper portions ofthe fin structures 104A and 104B and forming the isolation feature 106.In some embodiments, the deposition process includes CVD (such as LPCVD,plasma enhanced CVD (PECVD), high density plasma CVD (HDP-CVD), highaspect ratio process (HARP), flowable CVD (FCVD)), atomic layerdeposition (ALD), another suitable technique, and/or a combination. Theplanarization may be chemical mechanical polish (CMP). A recessing depthmay be controlled (e.g., by controlling an etching time) so as toprovide the desired height of the exposed upper portions of the finstructures 104A and 104B.

A first dummy gate structure 108A is formed across the first finstructure 104A and a second dummy gate structure 108B is formed acrossthe second fin structure 104B, as shown in FIGS. 2A-1 and 2A-2, inaccordance with some embodiments. In some embodiments, the dummy gatestructures 108A and 108B extend in Y direction. That is, the dummy gatestructures 108A and 108B have longitudinal axes parallel to Y direction,in accordance with some embodiments. The dummy gate structures 108A and108B wrap the channel regions of the fin structures 108A and 108B, inaccordance with some embodiments.

The dummy gate structures 108A and 108B each includes a dummy gatedielectric layer 110 and a dummy gate electrode layer 112 formed overthe dummy gate dielectric layer 110, in accordance with someembodiments. In some embodiments, the dummy gate dielectric layers 110are made of one or more dielectric materials, such as silicon oxide(SiO), silicon nitride (SiN), silicon oxynitride (SiON), and/or acombination thereof. In some embodiments, the dielectric material isformed using ALD, CVD, thermal oxidation, another suitable technique,and/or a combination thereof. In some embodiments, the dummy gateelectrode layers 112 are made of a conductive material, such aspolysilicon, poly-silicon germanium, and/or a combination thereof. Insome embodiments, the conductive material is formed using CVD, anothersuitable technique, and/or a combination thereof. In some embodiments,the formation of the dummy gate structures 108A and 108B includesconformally depositing a dielectric material for the dummy gatedielectric layer 110 over the semiconductor device structure 11,depositing a conductive material for the dummy gate electrode layer 112over the dielectric material, planarizing the conductive material, andpatterning the conductive material and dielectric material into thedummy gate structures 108A and 108B.

Gate spacer layers 113 are formed along and cover opposite sidewalls ofthe dummy gate structures 108A and 108B, as shown in FIGS. 2A-1 and2A-2, in accordance with some embodiments. The gate spacer layers 113are configured to offset the subsequently formed source/drain featuresand separate the source/drain features from the gate structure, inaccordance with some embodiments.

In some embodiments, the gate spacer layers 113 are made of a dielectricmaterial, such as silicon oxide (SiO₂), silicon nitride (SiN), siliconcarbide (SiC), silicon oxynitride (SiON), silicon carbon nitride (SiCN),silicon oxide carbonitride (SiOCN), and/or a combination thereof. Insome embodiments, the formation of the gate spacer layers 113 includesconformally depositing a dielectric material for the gate spacer layers113 over the semiconductor device structure 11 followed by ananisotropic etching process such as dry etching. The etching process isperformed to remove horizontal portions of the dielectric material forthe gate spacer layers 113, while leaving vertical portions of thedielectric material on sidewalls of the dummy gate structure 108A and108B to act as the gate spacer layers 113.

First source/drain features 114A are formed over the first fin structure104A and second source/drain features 114B are formed over the secondfin structure 104B, as shown in FIGS. 2A-1 and 2A-2, in accordance withsome embodiments. The source/drain features 114A and 114B are formed onopposite sides of the dummy gate structure 108A and 108B, in accordancewith some embodiments.

The formation of the source/drain features 114A and 114B includesrecessing the fin structures 104A and 104B to form source/drain recesses(not shown) at the source/drain regions, in accordance with someembodiments. A recessing depth may be dependent on the desired height ofthe source/drain features 114A and 114B for performance consideration.Afterward, one or more semiconductor material for the source/drainfeatures 114A and 114B are grown on the fin structures 104A and 104Bfrom the source/drain recesses using epitaxial growth processes, inaccordance with some embodiments. The epitaxial growth process may bemolecular beam epitaxy (MBE), metal organic chemical vapor deposition(MOCVD), or vapor phase epitaxy (VPE), another suitable technique, or acombination thereof.

In some embodiments, the source/drain features 114A and 114B are made ofany suitable semiconductor material, such as Ge, Si, GaAs, AlGaAs, SiGe,GaAsP, SiP, SiC, SiCP, or a combination thereof. In some embodiments,the source/drain features 114A and 114B are doped in-situ during theepitaxial growth process. For example, the source/drain features 114Aand 114B may be the epitaxially grown SiGe doped with boron (B). Forexample, the source/drain features 114A and 114B may be the epitaxiallygrown Si doped with carbon to form silicon:carbon (Si:C) source/drainfeatures, phosphorous to form silicon:phosphor (Si:P) source/drainfeatures, or both carbon and phosphorous to form silicon carbon phosphor(SiCP) source/drain features. The growths of the first source/drainfeatures 114A and the second source/drain features 114B may be performedseparately.

A lower interlayer dielectric layer 116 is formed over the semiconductordevice structure 11, as shown in FIGS. 2A-1 and 2A-2, in accordance withsome embodiments. The lower interlayer dielectric layer 116 is formed tocover the source/drain features 114A and 114B, in accordance with someembodiments.

In some embodiments, the lower interlayer dielectric layer 116 is madeof a dielectric material, such as un-doped silicate glass (USG), ordoped silicon oxide such as borophosphosilicate glass (BPSG),fluoride-doped silicate glass (FSG), phosphosilicate glass (PSG),borosilicate glass (BSG), and/or another suitable dielectric material.In some embodiments, a dielectric material for the lower interlayerdielectric layer 116 is deposited using such as CVD (such as HDP-CVD,PECVD, or HARP), another suitable technique, and/or a combinationthereof. In some embodiments, the lower interlayer dielectric layer 116is a multilayer structure. For example, the lower interlayer dielectriclayer 116 may include a thin silicon nitride-based etching stop layerand a silicon oxide-based bulk layer formed over the etching stop layer.Afterward, the dielectric material for the lower interlayer dielectriclayer 116 above the upper surfaces of the dummy gate electrode layers112 is removed using such as CMP until the dummy gate electrode layers112 are exposed. In some embodiments, the upper surface of the lowerinterlayer dielectric layer 116 is substantially coplanar with the uppersurfaces of the dummy gate electrode layers 112.

FIGS. 2B-1 and 2B-2 are cross-sectional views of a semiconductor devicestructure 11 after the formation of final gate stacks 118A and 118B, inaccordance with some embodiments. The dummy gate structures 108A and108B are removed using an etching process to form gate trenches (notshown), in accordance with some embodiments. The gate trenches exposethe channel regions of the fin structures 104A and 104B, in accordancewith some embodiments. In some embodiments, the etching process includesone or more etching processes. For example, when the dummy gateelectrode layers 112 are made of polysilicon, a wet etchant such as atetramethylammonium hydroxide (TMAH) solution may be used to selectivelyremove the dummy gate electrode layer 116. For example, the dummy gatedielectric layers 110 may be thereafter removed using a plasma dryetching, a dry chemical etching, and/or a wet etching.

A first final gate stack 118A is formed to fill the gate trench and wraparound the channel region of the first fin structure 104A and a secondfinal gate stack 118B is formed to fill the gate trench and wrap aroundthe channel region of the second fin structure 104B, as shown in FIGS.2B-1 and 2B-2, in accordance with some embodiments. The first final gatestack 118A extends across the channel region of the first fin structure104A and the second final gate stack 118B extends across the channelregion of the second fin structure 104B, in accordance with someembodiments. In some embodiments, the final gate stacks 118A and 118Bextend in Y direction. That is, the final gate stacks 118A and 118B havelongitudinal axes parallel to Y direction, in accordance with someembodiments.

The final gate stacks 118A and 118B each include an interfacial layer120, a high-k gate dielectric layer 122 and a metal gate electrode layer124, in accordance with some embodiments. The interfacial layers 120 areformed on the surfaces of the fin structures 104A and 104B exposed fromthe gate trenches, in accordance with some embodiments. In someembodiments, the interfacial layers 120 are made of a chemically formedsilicon oxide. In some embodiments, the interfacial layers 120 areformed using one or more cleaning processes such as including ozone(O₃).

The high-k gate dielectric layers 122 are formed conformally along theinterfacial layer 120, in accordance with some embodiments. The high-kgate dielectric layers 122 are also conformally formed along the innersidewalls of the gate spacer layers 113 facing the channel region, asshown in FIG. 2B-1, in accordance with some embodiments. The high-k gatedielectric layers 122 are also conformally formed along the uppersurface of the isolation feature 106, as shown in FIG. 2B-2, inaccordance with some embodiments In some embodiments, the high-k gatedielectric layers 122 are made of a dielectric material with highdielectric constant (k value), for example, greater than 3.9. In someembodiments, the high-K dielectric material includes hafnium oxide(HfO₂), TiO₂, HfZrO, Ta₂O₃, HfSiO₄, ZrO₂, ZrSiO₂, LaO, AlO, ZrO, TiO,Ta₂O₅, Y₂O₃, SrTiO₃ (STO), BaTiO₃ (BTO), BaZrO, HfZrO, HfLaO, HfSiO,LaSiO, AlSiO, HfTaO, HfTiO, (Ba,Sr) TiO₃ (BST), Al₂O₃, Si₃N₄,oxynitrides (SiON), a combination thereof, or another suitable material.The high-k gate dielectric layer 122 may be formed by ALD, PVD, CVD,and/or another suitable technique.

The metal gate electrode layers 124 are formed over the high-k gatedielectric layers 122 and fill the remainders of the gate trenches, inaccordance with some embodiments. In some embodiments, the metal gateelectrode layers 124 are made of more than one conductive material, suchas a metal, metal alloy, conductive metal oxide and/or metal nitride,another suitable conductive material, and/or a combination thereof. Themetal gate electrode layers 124 may be a multi-layer structure withvarious combinations of a diffusion barrier layer, a work function layerwith a selected work function to enhance the device performance (e.g.,threshold voltage), a capping layer to prevent oxidation of a workfunction layer, a glue layer to adhere the work function layer to a nextlayer, and a metal fill layer to reduce the total resistance of thefinal gate stack, and/or another suitable layer. The metal gateelectrode layers 124 may be made of Ti, Ag, Al, TiAlN, TaC, TaCN, TaSiN,Mn, Zr, TiN, TaN, Ru, Mo, Al, WN, Cu, W, Re, Ir, Co, Ni, anothersuitable conductive material, or multilayers thereof. The metal gateelectrode layer may be formed by ALD, PVD, CVD, e-beam evaporation, oranother suitable process. Furthermore, the metal gate electrode layers124 of the first final gate stack 118A and the second final gate stack118B may be formed separately.

A planarization process such as CMP may be performed on thesemiconductor device structure 11 to remove the materials of the high-kgate dielectric layers 122 and the metal gate electrode layers 124formed above the upper surface of the lower interlayer dielectric layer116, in accordance with some embodiments. After the planarizationprocess, the upper surfaces of the metal gate electrode layers 124 andthe upper surface of the lower interlayer dielectric layer 116 aresubstantially coplanar, in accordance with some embodiments.

The interfacial layers 120, the high-k gate dielectric layers 122 andthe metal gate electrode layers 124 combine to form the final gatestacks 118A and 118B, in accordance with some embodiments. The firstfinal gate stack 118A combines with the first source/drain features 114Ato form a first transistor 180A (such as a FinFET) and the second finalgate stack 118B combines with the second source/drain features 114B toform a second transistor 180B (such as a FinFET), as shown in FIG. 2B-1,in accordance with some embodiments. The final gate stacks 118A and 118Bmay engage the channel region of the transistors so that a current canflow between the source and the drain of the source/drain features 114Aand/or between the source and the drain of the source/drain features114B during operation.

FIGS. 2C-1 and 2C-2 are cross-sectional views of a semiconductor devicestructure 11 after the formation of recesses 126A and 126B, inaccordance with some embodiments. One or more etching process isperformed on the semiconductor device structure 11 to recess the high-kgate dielectric layers 122 and the metal gate electrode layers 124, inaccordance with some embodiments. A first recess 126A is formed betweenthe gate spacer layers 113 over the first final gate stack 118A and asecond recess 126B is formed between the gate spacer layers 113 over thesecond final gate stack 118B, as shown in FIGS. 2C-1 and 2C-2, inaccordance with some embodiments. In some embodiments, the etchingprocess is dry etching and/or wet etching. A recessing depth may becontrolled (e.g., by controlling an etching time) so as to result in thedesired height of the final gate stacks 118A and 118B.

FIGS. 2D-1 and 2D-2 are cross-sectional views of a semiconductor devicestructure 11 after the formation of dielectric capping layers 128A and128B, in accordance with some embodiments. A first dielectric cappinglayer 128A is formed to fill the first recess 126A and a seconddielectric capping layer 128B is formed to fill the second recess 126B,as shown in FIGS. 2D-1 and 2D-2, in accordance with some embodiments.

In some embodiments, the dielectric capping layers 128A and 128B aremade of an insulating material e.g., SiO, SiN, SiOC, SiON, SiOCN, SiCN,SiC, LaO, AlO, AlON, ZrO, HfO, SiN, ZnO, ZrN, ZrAlO, TiO, TaO, YO,and/or TaCN. In some embodiments, the formation of the dielectriccapping layers 128A and 128B includes depositing an insulating materialfor the dielectric capping layers 128A and 128B over the semiconductordevice structure 11, removing the insulating material over the uppersurface of the lower interlayer dielectric layer 116 using such as CMPor etching-back process until the lower interlayer dielectric layer 116is exposed. In some embodiments, the deposition process may be CVD (suchas HDP-CVD, PECVD, or HARP), ALD, another suitable method, and/or acombination thereof. In some embodiments, the upper surfaces of thedielectric capping layers 128A and 128B, the upper surface of the lowerinterlayer dielectric layer 116 and the upper surfaces of the gatespacer layers 113 are substantially coplanar.

FIGS. 2E-1 and 2E-2 are cross-sectional views of a semiconductor devicestructure 11 after the removal of the second dielectric capping layer128B, in accordance with some embodiments. A mask element 130 is formedto cover the first region 102A of the semiconductor device structure 11,as shown in FIGS. 2E-1 and 2E-2, in accordance with some embodiments.The mask element 130 may be a patterned photoresist layer or a patternedhard mask layer. An etching process is performed on the semiconductordevice structure 11 to remove the second dielectric capping layer 128B,which is uncovered by the mask element 130, until the metal gateelectrode layer 124 and the high-k gate dielectric layer 122 of thesecond final gate stack 118B are exposed, in accordance with someembodiments. The original second recess 126B is formed again and denotedas a second recess 132B, as shown in FIGS. 2E-1 and 2E-2. In someembodiments, the etching process is dry etching and/or wet etching. Insome embodiments, the mask element 130 is removed using such as anashing process after the etching process.

FIGS. 2F-1 and 2F-2 are cross-sectional views of a semiconductor devicestructure 11 after the formation of an electrode material 134, inaccordance with some embodiments. A electrode material 134 isconformally formed along and covers the upper surface of the lowerinterlayer dielectric layer 116, the upper surfaces of the gate spacerlayers 113, the upper surface of the first dielectric capping layer128A, and the sidewalls and the bottom surface of the second recess 132B(i.e., the surface of the gate spacer layers 113, the metal gateelectrode layer 124 and the high-k gate dielectric layer 122 exposedfrom the second recess 132B), as shown in FIGS. 2F-1 and 2F-2, inaccordance with some embodiments. The electrode material 134 conforms tothe profile of the second recess 132B and partially fills the secondrecess 132B, in accordance with some embodiments. In some embodiments,the electrode material 134 is made of TiN, TaN, W, Ru, another suitableelectrode material, or a combination thereof. In some embodiments, theelectrode material 134 is deposited using PVD, ALD, electroplating, oranother suitable technique.

FIGS. 2G-1 and 2G-2 are cross-sectional views of a semiconductor devicestructure 11 after the formation of a bottom electrode layer 134B, inaccordance with some embodiments. The portions of the electrode material134 formed along the upper surface of the lower interlayer dielectriclayer 116, the upper surfaces of the gate spacer layers 113, the uppersurface of the first dielectric capping layer 128A are removed usingsuch as CMP, in accordance with some embodiments. The portions of theelectrode material 134 formed along the sidewalls of the second recess132B are then removed using an etching back process, in accordance withsome embodiments. A portion of the electrode material 134 remaining onthe bottom surface of the second recess 132B forms a bottom electrodelayer 134B for a capacitor above the transistor 180B, in accordance withsome embodiments.

FIGS. 2H-1 and 2H-2 are cross-sectional views of a semiconductor devicestructure 11 after the formation of a ferroelectric material 136, inaccordance with some embodiments. A ferroelectric material 136 is formedover the upper surfaces of the lower interlayer dielectric layer 116,the gate spacer layers 113, and the first dielectric capping layer 128Aand fills the remainder of the second recess 132B, as shown in FIGS.2H-1 and 2H-2, in accordance with some embodiments. In some embodiments,the ferroelectric material 136 is a non-linear dielectric material thatcan exhibit a hysteresis loop in accordance with an electric fieldcaused by a dielectric polarization. A FeFET device comprising theferroelectric material can be operable as a non-volatile memory devicedue to the dielectric polarization characteristics of the ferroelectricmaterial. Namely, a ferroelectric material may be a material thatexhibits electrically switchable polarization. In some embodiments, theferroelectric material 136 is made of an Hf-based dielectric material,e.g., HfZrO, HfLaO, HfSiO, HfAlO, another suitable ferroelectricmaterial, or a combination thereof. In some embodiments, theferroelectric material 136 is deposited using CVD, ALD, PVD or anothersuitable technique.

FIGS. 2I-1 and 2I-2 are cross-sectional views of a semiconductor devicestructure 11 after the removal of a portion of the ferroelectricmaterial 136, in accordance with some embodiments. A mask element 138 isformed to cover the second region 102B of the semiconductor devicestructure 11, as shown in FIGS. 2I-1 and 2I-2, in accordance with someembodiments. The mask element 138 may be a patterned photoresist layeror a patterned hard mask layer. An etching process is performed on thesemiconductor device structure 11 to remove a portion of theferroelectric material 136 in the first region 102A, which is uncoveredby the mask element 138, until the lower interlayer dielectric layer116, the gate spacer layers 113 and the first dielectric capping layer128A are exposed, in accordance with some embodiments. In someembodiments, the etching process is dry etching and/or wet etching. Insome embodiments, the mask element 138 is removed using such as anashing process after the etching process.

FIGS. 2J-1 and 2J-2 are cross-sectional views of a semiconductor devicestructure 11 after the formation of a ferroelectric layer 136B, inaccordance with some embodiments. A portion of the ferroelectricmaterial 136 above the upper surface of the lower interlayer dielectriclayer 116 in the second region 102B is removed using such as CMP untilthe lower interlayer dielectric layer 116 and the gate spacer layers 113are exposed, as shown in FIGS. 2J-1 and 2J-2, in accordance with someembodiments. A portion of the ferroelectric material 136 remaining inthe second recess 132B forms a ferroelectric layer 136B for a capacitorabove the transistor 180B, in accordance with some embodiments. In someembodiments, the ferroelectric layer 136B has a thickness in a rangefrom about 5 nm to about 10 nm. An anneal process may be then performedto crystallize the ferroelectric layer 136B in the ferroelectric phase.For example, the anneal process may be performed with 600° C. to about1200° C.

Afterward, a multilayer interconnect (MLI) structure is formed over thesemiconductor device structure 11, in accordance with some embodiments.The multilayer interconnect structure electrically couples variousdevices (such as transistors, resistors, capacitors, and/or inductors)and/or the conductive features of the various devices (such as,electrode layer, source/drain region, and/or the gate, in accordancewith some embodiments. In some embodiments, the multilayer interconnectstructure includes a combination of dielectric layers and electricallyconductive features, e.g., contact plugs, vias and/or metal lines.

FIGS. 2K-1 and 2K-2 are cross-sectional views of a semiconductor devicestructure 11 after the formation of contact plugs 140, in accordancewith some embodiments. Contact plugs 140 are formed through the lowerinterlayer dielectric layer 116 and land on the source/drain features114A and 114B, as shown in FIGS. 2K-1 and 2K-2, in accordance with someembodiments. In some embodiments, the contact plugs 140 are made of oneor more conductive materials, for example, cobalt (Co), nickel (Ni),tungsten (W), titanium (Ti), tantalum (Ta), copper (Cu), aluminum (Al),ruthenium (Ru), molybdenum (Mo), TiN, TaN, and/or a combination thereof.

In some embodiments, the formation of the contact plugs includespatterning the lower interlayer dielectric layer 116 to form contactopenings (not shown) through the lower interlayer dielectric layer 116and exposing the source/drain features 114A and 114B, depositing aconductive material for the contact plugs 140 to fill the contactopenings, and removing the conductive material over the upper surface ofthe lower interlayer dielectric layer 116 using such as CMP. In someembodiments, the conductive material is deposited using PVD, ALD, CVD,e-beam evaporation, electroplating (ECP), electroless deposition (ELD),another suitable method, or a combination thereof. In some embodiments,the upper surface of the lower interlayer dielectric layer 116, theupper surfaces of the gate spacer layers 113, the upper surface of thefirst dielectric capping layer 128A, the upper surface of theferroelectric layer 136B and the upper surfaces of the contact plugs 140are substantially coplanar. In some embodiments, the contact plugsinclude a silicide layer, such as WSi, NiSi, TiSi or CoSi, formed on thesurface of the source/drain features 114A and 114B exposed from thecontact openings.

FIGS. 2L-1 and 2L-2 are cross-sectional views of a semiconductor devicestructure 11 after the formation of an upper interlayer dielectric layer142, source/drain vias 144, an upper electrode layer 146B, a gate via148A, and a capacitor via 149B, in accordance with some embodiments. Anupper interlayer dielectric layer 142 is formed over the semiconductordevice structure 11, as shown in FIGS. 2L-1 and 2L-2, in accordance withsome embodiments. In some embodiments, the upper interlayer dielectriclayer 142 is made of a dielectric material, such as USG, or dopedsilicon oxide such as BPSG, FSG, PSG, BSG, and/or another suitabledielectric material. In some embodiments, the upper interlayerdielectric layer 142 is formed using CVD (such as HDP-CVD, PECVD, orHARP), ALD, another suitable method, and/or a combination thereof. Insome embodiments, the upper interlayer dielectric layer 142 is amultilayer structure. For example, the upper interlayer dielectric layer142 may include a thin silicon nitride-based etching stop layer and asilicon oxide-based bulk layer formed over the etching stop layer.

Source/drain vias 144 are formed through the upper interlayer dielectriclayer 142 and land on the contact plugs 140, as shown in FIGS. 2L-1 and2L-2, in accordance with some embodiments. The source/drain vias 144 areelectrically coupled to the source/drain features 114A and 114B, inaccordance with some embodiments. A gate via 148A is formed through theupper interlayer dielectric layer 142 and the first dielectric cappinglayer 128A and land on the metal gate electrode layer 124 of the firstfinal gate stack 118A, thereby forming a FinFET device 11A in the firstregion 102A of the substrate 102, as shown in FIGS. 2L-1 and 2L-2, inaccordance with some embodiments. The gate via 148A is electricallycoupled to the first final gate stack 118A, in accordance with someembodiments.

An upper electrode layer 146B and a capacitor via 149B nested within theupper electrode layer 146B are collectively formed through the upperinterlayer dielectric layer 142 and land on the ferroelectric layer136B, thereby forming a FeFET device 11B with FinFET design in thesecond region 102B of the substrate 102, as shown in FIGS. 2L-1 and2L-2, in accordance with some embodiments. The upper electrode layer146B has a U-shape profile defining a space where the capacitor via 149Bis nested therein, in accordance with some embodiments. The upperelectrode layer 146B, the ferroelectric layer 136B and the bottomelectrode layer 134B combine to form a capacitor 150B above thetransistor 180B, in accordance with some embodiments. The capacitor via149B is electrically the capacitor 150B, in accordance with someembodiments. In some embodiments, the capacitor via 149B is short thanthe gate via 148A.

In some embodiments, the source/drain via 144, the gate via 148A and thecapacitor via 149B are made of one or more conductive materials, forexample, copper (Cu), cobalt (Co), ruthenium (Ru), molybdenum (Mo),chromium (Cr), tungsten (W), manganese (Mn), rhodium (Rh), iridium (Ir),nickel (Ni), palladium (Pd), platinum (Pt), silver (Ag), golden (Au),aluminum, and/or a combination thereof. In some embodiments, the upperelectrode layer 146B is made of metallic nitride such as TiN, TaN, WN,etc.

In some embodiments, a patterning process is performed on thesemiconductor device structure 11 to form a via hole (not shown) for theupper electrode layer 146B and the capacitor via 149B through the upperinterlayer dielectric layer 142 to the ferroelectric layer 136B. In someembodiments, an electrode material for the upper electrode layer 146B isconformally depositing along the upper surface of the upper interlayerdielectric layer 142 and the sidewalls and the bottom surface of the viahole, and a conductive material for the capacitor via 149B is depositedover the electrode material and fills the remainder of the via hole. Theelectrode material and the conductive material over the upper surface ofthe upper interlayer dielectric layer 142 are then removed by using suchas CMP.

In some embodiments, a patterning process is performed on thesemiconductor device structure 11 to form via holes (not shown) for thesource/drain vias 144 through the upper interlayer dielectric layer 142to the contact plugs 140 and a via hole (not shown) for the gate via148A through the upper interlayer dielectric layer 142 and the firstdielectric capping layer 128A to the metal gate electrode layer 124. Aconductive material for the source/drain vias 144 and the gate via 148Ais deposited over the upper interlayer dielectric layer 142 and fillsthe via holes. The conductive material over the upper surface of theupper interlayer dielectric layer 142 is then removed by using such asCMP. In addition, the dielectric capping layer 128A may be a differentetching selectivity than adjacent dielectric layers (e.g., gate spacerlayer 113), thereby improving the overlay window of the patterningprocess of forming the via hole for the gate via 148A.

The FinFET device 11A may be operable as a logic device, a peripherycircuit device, or an SRAM device. The FeFET device 11B comprising theferroelectric layer 136B may be operable as a FRAM device due to thedielectric polarization characteristics of the ferroelectric layer 136B.For example, during a write operation, one or more bias voltages can beapplied to cause charge carriers (e.g., electrons and/or holes) toaccumulate between the source/drain features 114B of the secondtransistor 180B. The charge carriers generate electric fields, which mayextend through the ferroelectric layer 136B. The electric fields areconfigured to change positions of electric dipoles within theferroelectric layer 136B depending on the bias voltages, in accordancewith some embodiments. If the magnetic polarization of the ferroelectriclayer 136B has a first polarization on a specific bias voltage, theFeFET device 11B will digitally store data as a first bit value (e.g., alogical “0”). Alternatively, if the magnetic polarization of theferroelectric layer 136B has a second polarization on a different biasvoltage from the former, the FeFET device 11B will digitally store dataas a second bit value (e.g., a logical “1”).

Other conductive features of the multilayer interconnect structure (suchas vias and metal lines within an intermetal dielectric layer over theupper interlayer dielectric layer 142) may be formed over thesemiconductor device structure 11 and electrically coupled to theconductive features of the FinFET device 11A and the FeFET device 11B.In some embodiments, the FinFET device 11A is operable to access and/orcontrol the FeFET device 11B (e.g., to perform read/write/eraseoperations) through the multilayer interconnect structure.

The embodiments of the present disclosure provide a semiconductor devicestructure having a FeFET device with capacitor above transistor (CAT)design, where the capacitor 150B is formed directly above andelectrically connected to the second final stack 118B. The FeFET devicewith CAT design may provide benefits, in some embodiments, one or moreof: (1) an increase in the endurance and the retention of the FeFET dueto Hf-based ferroelectric layer may be annealed to reduce thedepolarization field, (2) a lower power consumption due to the capacitoris immediately above and coupled to the gate stack, and/or (3) a simplefabrication process in which a relatively small number of lithographyprocesses is used to replace the dielectric capping layer into theferroelectric layer of the capacitor.

FIG. 3 is a flowchart of a method 1000 for forming a semiconductordevice structure, in accordance with some embodiments of the disclosure.The method 1000 is used to form the semiconductor device structure 11 asdescribed above, in accordance with some embodiments. In operation 1002,a first fin structure 104A and a second fin structure 104B, which areused as active regions, are formed, as shown in FIG. 1, in accordancewith some embodiments. In operation 1004, a first final gate stack 118Ais formed across the first fin structure 104A and a second final gatestack 118B is formed across the second fin structure 104B, as shown inFIGS. 2B-1 and 2B-2, in accordance with some embodiments. The firstfinal gate stack 118A and the second final gate stack 118B are recessedto form a first recess 126A over the first final gate stack 118A and asecond recess 126B over the second final gate stack 118B, as shown inFIGS. 2C-1 and 2C-2, in accordance with some embodiments. A firstdielectric capping layer 128A is formed in the first recess 126A, asshown in FIGS. 2D-1 and 2D-2, in accordance with some embodiments. Aferroelectric layer 136B is formed in the second recess 132B (i.e.,original second recess 126B), as shown in FIGS. 2E-1 through 2J-2, inaccordance with some embodiments. A top electrode layer 146B is formedover the ferroelectric layer 136B, as shown in FIGS. 2L-1 and 2L-2, inaccordance with some embodiments.

FIGS. 4-1 and 4-2 are cross-sectional views of a semiconductor devicestructure 12 with FinFET design, in accordance with some embodiments.FIG. 4-1 is a cross-sectional view in the second region 102Bcorresponding to cross-section X-X of FIG. 1 and FIG. 4-2 is across-sectional view in the second region 102B corresponding tocross-section Y-Y of FIG. 1. The semiconductor device structure 12 ofFIGS. 4-1 and 4-2 is similar to the semiconductor device structure 11 ofFIGS. 2L-1 and 2L-2 except for the bottom electrode layer not formedbetween the ferroelectric layer 136B and the second final gate stack118B, in accordance with some embodiments. The steps described abovewith respect to FIGS. 2F-1 through 2G-2 may be omitted, and theferroelectric layer 136B is formed in direct contact with the secondfinal gate stack 118B, thereby forming a FeFET device 12B in the secondregion 102B of the substrate 102, in accordance with some embodiments.The metal gate electrode layer 124 of the second final gate stack 118Bis used as the bottom electrode layer of the capacitor 150B, inaccordance with some embodiments.

FIGS. 5A and 5B are cross-sectional views illustrating the formation ofa semiconductor device structure 13 with FinFET design at variousintermediate stages, in accordance with some embodiments. FIGS. 5A and5B are cross-sectional views corresponding to cross-section X-X ofFIG. 1. The semiconductor device structure 13 of FIG. 5B is similar tothe semiconductor device structure 11 of FIG. 2L-1 except that the firstdielectric capping layer 128A covers the upper surface of the gatespacer layers 113 and the ferroelectric layer 136B covers the uppersurface of the gate spacer layers 113, in accordance with someembodiments.

Continuing from FIG. 2C-1, the gate spacer layers 113 are also recessedwhile the final gate stacks 118A and 118B are being recessed, inaccordance with some embodiments, as shown in FIG. 5A. In someembodiments, the etching rate of the gate spacer layers 113 is lowerthan the etching rate of the metal electrode layers 124 and the etchingrate of the high-k gate dielectric layer 122, and as a result, therecessed gate spacer layers 113 are higher than the recessed final gatestacks 118A and 118B. The first recesses 126A is formed over the gatespacer layers 113 and the first final gate stack 118A within the lowerinterlayer dielectric layer 116 and the second recess 126B is formedover the gate spacer layers 113 and the second final gate stack and 118Bwithin the lower interlayer dielectric layer 116, in accordance withsome embodiments.

The steps described above with respect to FIGS. 2D-1 through 2L-2 areperformed on the semiconductor device structure 13 of FIG. 5A to form aFinFET device 13A and a FeFET device 13B, in accordance with someembodiments. As a result, the first dielectric capping layer 128Aincludes a lower portion between the gate spacer layers 113 and an upperportion over the upper surfaces of the gate spacer layers 113, and theupper portion of the first dielectric capping layer 128A is wider thanthe lower portion of the first dielectric capping layer 128A, inaccordance with some embodiments. Similarly, the ferroelectric layer136B includes a lower portion between the gate spacer layers 113 and anupper portion over the upper surfaces of the gate spacer layers 113, andthe upper portion of the ferroelectric layer 136B is wider than thelower portion of the ferroelectric layer 136B, in accordance with someembodiments.

FIGS. 6A-1 through 6D-2 are cross-sectional views illustrating theformation of a semiconductor device structure 14 with FinFET design atvarious intermediate stages, in accordance with some embodiments. FIGS.6A-1, 6B-1, 6C-1 and 6D-1 are cross-sectional views corresponding tocross-section X-X of FIG. 1 and FIGS. 6A-2, 6B-2, 6C-2 and 6D-2 arecross-sectional views in the second region 102B corresponding tocross-section Y-Y of FIG. 1. The semiconductor device structure 14 ofFIGS. 6D-1 and 6D-2 is similar to the semiconductor device structure 11of FIGS. 2L-1 and 2L-2 except that a capacitor 150B that includes abottom electrode layer 134B, a ferroelectric layer 136B, and a topelectrode layer 146B is formed in a via hole, in accordance with someembodiments.

The steps of FIGS. 2E-1 through 2J-2 are omitted, and the seconddielectric capping layer 128B remains on the second final gate stack118B, as shown in FIGS. 6A-1 and 6A-2, in accordance with someembodiments. A patterning process is performed on the semiconductordevice structure 14 to form a via hole 152B through the upper interlayerdielectric layer 142 and the second dielectric capping layer 128B to themetal gate electrode layer 124 of the second final gate stack 118B, asshown in FIGS. 6B-1 and 6B-2, in accordance with some embodiments. Thepatterning process may include forming a patterned mask layer over theupper interlayer dielectric layer 142 and etching the upper interlayerdielectric layer 142 and the second dielectric capping layer 128Buncovered by the patterned mask layer until the metal gate electrode 124is exposed.

A bottom electrode layer 134B is formed at the bottom of the via hole152B, as shown in FIGS. 6C-1 and 6C-2, in accordance with someembodiments. The bottom electrode layer 134B may be formed using adeposition process, a CMP process and an etching back process. Aferroelectric layer 136B is formed over the bottom electrode layer 134Bto fill the remainder of the via hole 152B, as shown in FIGS. 6D-1 and6D-2, in accordance with some embodiments. The ferroelectric layer 136Bmay be formed using a deposition process and a CMP process. Afterward,the ferroelectric layer 136B is etched back to form a recess and a topelectrode layer 146B is formed to fill the recess over the ferroelectriclayer 136B, thereby forming a FeFET device 14B, as shown in FIGS. 6D-1and 6D-2, in accordance with some embodiments. The top electrode layer146B may be formed using a deposition process and a CMP process.

The top electrode layer 146B, the ferroelectric layer 136B, and thebottom electrode layer 134B combine to form a capacitor 150B, which isformed in the via hole 152B and passes through the upper interlayerdielectric layer 142 and the second dielectric capping layer 128B to thesecond final gate stack 118B, in accordance with some embodiments. Assuch, the sidewall of the top electrode layer 146B, the sidewall of theferroelectric layer 136B, and the sidewall of the bottom electrode layer134B share a continuous surface (i.e., the sidewall of the via hole152B), in accordance with some embodiments. In some embodiments, theupper surface of the top electrode layer 146B, the upper surface of thevias 144 and 148A are substantially coplanar. In some embodiments, theheight of the capacitor 150B is substantially equal to the height of thegate via 148A.

FIGS. 7A-1 through 7B-2 are cross-sectional views illustrating theformation of a semiconductor device structure 15 with FinFET design atvarious intermediate stages, in accordance with some embodiments of thedisclosure. FIGS. 7A-1 and 7B-1 are cross-sectional views correspondingto cross-section X-X of FIG. 1 and FIGS. 7A-2 and 7B-2 arecross-sectional views in the second region 102B corresponding tocross-section Y-Y of FIG. 1. The semiconductor device structure 15 ofFIGS. 7B-1 and 7B-2 is similar to the semiconductor device structure 14of FIGS. 6D-1 and 6D-2 except that a capacitor via 149B and a capacitor150B are formed in the same via hole, in accordance with someembodiments.

The ferroelectric layer 136B is etched back to a greater depth than thedepth shown in FIGS. 6D-1 and 6D-2 and the top electrode layer 146B isformed over the ferroelectric layer 136B to partially fill the recess(i.e., the via hole 152B), in accordance with some embodiments. Acapacitor via 149B is formed to fill a remainder of the via holes 152B,thereby forming a FeFET device 15B, in accordance with some embodiments.In some embodiments, the sidewall of the capacitor via 149B and thesidewall of the capacitor 150B including the top electrode layer 146B,the ferroelectric layer 136B and the bottom electrode layer 134B share acontinuous surface (i.e., the sidewall of the via hole 152B). In someembodiments, the capacitor via 149B is shorter than the gate via 148A.

Although the embodiments described above are used in the semiconductordevice structure with FinFET design, the concept of the embodiments maybe also used in a semiconductor device structure with GAA design. FIG. 8is a perspective view of a semiconductor device structure 21 with GAAdesign, in accordance with some embodiments of the disclosure. FIGS.9A-1 through 9D-2 are cross-sectional views illustrating the formationof the semiconductor device structure 21 with GAA design at variousintermediate stages, in accordance with some embodiments of thedisclosure. FIGS. 9A-1, 9B-1, 9C-1 and 9D-1 are cross-sectional viewscorresponding to cross-section X-X of FIG. 8 and FIGS. 9A-2, 9B-2, 9C-2and 9D-2 are cross-sectional views corresponding to cross-section Y-Y ofFIG. 8. The method 1000 of FIG. 3 may also be used to form thesemiconductor device structure 21, in accordance with some embodiments.Note that the same or similar elements or layers of the semiconductordevice structure 21 corresponding to those of the semiconductor devicestructure 11 shown in FIGS. 1 through 2L-2 are denoted by like referencenumerals. The same or similar elements or layers denoted by likereference numerals have the same meaning and will not be repeated forthe sake of brevity.

A semiconductor device structure 21 is provided, as shown in FIG. 8, inaccordance with some embodiments. The semiconductor device structure 21includes a substrate 102 and a first fin structure 204A over a firstregion 102A of the substrate 102 and a second fin structure 204B formedover a second region 102B of the substrate 102, in accordance with someembodiments.

The fin structures 204A and 204B extend in the X direction, inaccordance with some embodiments. That is, the fin structures 204A and204B each have a longitudinal axis parallel to X direction, inaccordance with some embodiments. Each of the fin structures 204A and204B includes a channel region CH and source/drain regions SD, where thechannel region CH is defined between the source/drain regions SD, inaccordance with some embodiments. Final gate stacks (not shown) will beformed with a longitudinal axis parallel to Y direction and extendingacross the channel regions CH of the fin structures 204A and 204B.

The fin structures 204A and 204B each include a lower fin element 203formed from a portion of the substrate 102 and an upper fin elementformed from a semiconductor stack, which includes first semiconductorlayers 206 and second semiconductor layers 208 alternately stacked overthe lower fin element 203, in accordance with some embodiments. It isnoted that two layers of each of the first semiconductor layers 206 andthe second semiconductor layers 208 are illustrated in FIG. 8, and thisis for illustrative purpose and not intended to be limiting beyond whatis specifically recited in the claims. It can be appreciated that anynumber of semiconductor layers can be formed in the stack; the number oflayers depending on the desired number of channels regions for the GAAtransistor.

As explained in detail below, the first semiconductor layers 206 of thefin structures 204A and 204B will be removed and the secondsemiconductor layers 208 of the fin structures 204A and 204B formnanostructures (e.g., nanowire or nanosheet structures) that laterallyextend between source/drain regions and serve as the channel layers forthe resulting transistors such as gate-all-around transistors, inaccordance with some embodiments. As the term is used herein,“nanostructures” refers to semiconductor layers that have cylindricalshape, bar shaped and/or sheet shape. Final gate stacks (not shown) willbe formed across and wrap around the nanostructures, in accordance withsome embodiments.

In some embodiments, the formation of the fin structures 204A and 204Bincludes forming a semiconductor stack including a first semiconductormaterial for the first semiconductor layers 206 and a secondsemiconductor material for the second semiconductor layers 208 over thesubstrate 102.

The first semiconductor material for the first semiconductor layers 206has a different lattice constant than the second semiconductor materialfor the second semiconductor layers 208, in accordance with someembodiments. In some embodiments, the first semiconductor layers 206 aremade of SiGe, where the percentage of germanium (Ge) in the SiGe is in arange from about 20 atomic % to about 50 atomic %, and the secondsemiconductor layers 208 are made of silicon. In some embodiments, thefirst semiconductor layers 206 are Si_(1-x)Ge_(x), where x is more thanabout 0.3, or Ge (x=1.0) and the second semiconductor layers 108 are Sior Si_(1-y)Ge_(y), where y is less than about 0.4, and x>y. In someembodiments, the first semiconductor material and the secondsemiconductor material are alternatingly formed using an epitaxialgrowth process such as MBE, MOCVD, or VPE, or another suitabletechnique. In some embodiments, the first semiconductor layers 206 andthe second semiconductor layers 208 have different oxidation ratesand/or etch selectivity.

In some embodiments, the thickness of each of the first semiconductorlayers 206 is in a range from about 1.5 nanometers (nm) to about 20 nm.In some embodiments, the first semiconductor layers 206 aresubstantially uniform in thickness. In some embodiments, the thicknessof each of the second semiconductor layers 208 is in a range from about1.5 nm to about 20 nm. In some embodiments, the second semiconductorlayers 208 are substantially uniform in thickness.

Afterward, the semiconductor stack including the first semiconductormaterial and the second semiconductor material and the underlyingsubstrate 102 are patterned into the fin structures 204A and 204B. Insome embodiments, the patterning process includes forming a patternedhard mask layer (not shown) over the semiconductor stack, and etchingthe semiconductor stack and the substrate 102 uncovered by the patternedhard mask layer to form trenches and the fin structures 204A and 204Bprotruding between from the trenches. In some embodiments, after theetching process, the substrate 102 has portions which protrude frombetween the trenches to form the lower fin elements 203 of the finstructures 204A and 204B. In some embodiments, the remainders of thesemiconductor stack directly above the lower fin elements 203 form theupper fin elements of the fin structures 204A and 204B. The finstructures 204A and 204B are active regions of the semiconductor devicestructure 21, which are to be formed into channel regions andsource/drain regions of transistors, e.g., gate-all-around FETs (GAAFETs), in accordance with some embodiments.

FIGS. 9A-1 and 9A-2 are cross-sectional views of a semiconductor devicestructure 21 after the formation of an isolation feature 106, dummy gatestructures 108A and 108B, gate spacer layers 113, source/drain features114A and 114B, inner spacer layers 210 and a lower interlayer dielectriclayer 116, in accordance with some embodiments. An isolation feature 106is formed over the substrate 102 and surrounds lower fin elements 203 ofthe fin structures 204A and 204B, as shown in FIGS. 9A-1 and 9A-2, inaccordance with some embodiments. A first dummy gate structure 108A isformed across the channel region of the first fin structure 204A and asecond dummy gate structure 108B is formed across the channel region ofthe second fin structure 204B, in accordance with some embodiments. Gatespacer layers 113 are formed along and cover opposite sidewalls of thedummy gate structures 108A and 108B, in accordance with someembodiments.

After the source/drain recesses (not shown) for the source/drainfeatures 114A and 114B are formed, the first semiconductor layers 206are laterally recessed toward the channel region, thereby formingnotches (not shown) between adjacent second semiconductor layers 208 andbetween the lowermost second semiconductor layer 208 and the lower finelement 203, in accordance with some embodiments. Inner spacer layers210 are formed in the notches and the source/drain features 114A and114B are then formed from the source/drain recesses, in accordance withsome embodiments.

The notches may be formed using a selective etching process caused bythe different etching rates between the first semiconductor layers 206and the second semiconductor layers 208. In some embodiments, the innerspacer layers 210 are made of a dielectric material, such as siliconoxycarbide (SiOC), silicon oxide carbonitride (SiOCN), silicon carbonnitride (SiCN), and/or a combination thereof, in accordance with someembodiments. In some embodiments, the inner spacer layers 210 are formedusing a deposition process followed by an etching process. In someembodiments, the deposition process includes ALD, CVD (such as PECVD orLPCVD), another suitable technique, and/or a combination thereof. Insome embodiments, the etching process includes a plasma dry etching, adry chemical etching, and/or a wet etching. The Inner spacer layers 210are aligned below the gate spacer layers 113, in accordance with someembodiments. The inner spacer layers 210 are configured to reduce theparasitic capacitance between the subsequently formed final gate stackand the source/drain features (i.e. Cgs and Cgd), in accordance withsome embodiments.

FIGS. 9B-1 and 9B-2 are cross-sectional views of a semiconductor devicestructure 21 after the formation of gate trenches 212 and gaps 214, inaccordance with some embodiments. The dummy gate structures 108A and108B are removed using an etching process to form gate trenches 212, asshown in FIGS. 9B-1 and 9B-2, in accordance with some embodiments.

The first semiconductor layers 206 are then removed using an etchingprocess to form gaps 214, as shown in FIGS. 9B-1 and 9B-2, in accordancewith some embodiments. The gaps 214 are formed between the adjacentsecond semiconductor layers 208 and between the lowermost secondsemiconductor layer 208 and the lower fin element 203, in accordancewith some embodiments. After the etching process, the four main surfacesof the second semiconductor layers 208 are exposed, in accordance withsome embodiments. The exposed second semiconductor layers 208 formnanostructures that function as channel layers of the resultingtransistor device (e.g., GAA transistor), in accordance with someembodiments. In some embodiments, the etching process includes aselective wet etching process, such as APM (e.g., ammoniahydroxide-hydrogen peroxide-water mixture) etching process. In someembodiments, the wet etching process uses etchants such as ammoniumhydroxide (NH₄OH), TMAH, ethylenediamine pyrocatechol (EDP), and/orpotassium hydroxide (KOH) solutions.

FIGS. 9C-1 and 9C-2 are cross-sectional views of a semiconductor devicestructure 21 after the formation of final gate stacks 118A and 118B, inaccordance with some embodiments. A first final gate stacks 118A isformed to fill the gate trench 212 and the gaps 214 and wrap around thesecond semiconductor layers 208 of the first fin structure 204A and asecond final gate stacks 118B is formed to fill gate trench 212 and thegaps 214 and wrap around the second semiconductor layers 208 of thesecond fin structure 204B, as shown in FIGS. 9C-1 and 9C-2, inaccordance with some embodiments. The first final gate stacks 118Acombines with the first source/drain features 114A to form a firsttransistor 280A (such as a GAA FET) and the second final gate stack 118Bcombines with the second source/drain features 114B to form a secondtransistor 280B (such as a GAA FET), as shown in FIG. 9C-1, inaccordance with some embodiments.

The final gate stacks 118A and 118B each include interfacial layers 120,high-k gate dielectric layers 122 and a metal gate electrode layer 124,in accordance with some embodiments. The interfacial layers 120 areformed on exposed main surfaces of the second semiconductor layers 208to wrap around respective second semiconductor layers 208, in accordancewith some embodiments. The interfacial layers 120 are further formed onthe exposed upper surface of the lower fin element 203, in accordancewith some embodiments.

The high-k gate dielectric layers 122 are formed conformally along theinterfacial layers 120 to around respective second semiconductor layers208, in accordance with some embodiments. The high-k gate dielectriclayers 122 are further conformally formed along the inner sidewalls ofthe inner spacer layers 210 facing the channel region, the innersidewalls of the gate spacer layer 120 facing the channel region, andthe upper surface of the isolation feature 106, in accordance with someembodiments. The metal gate electrode layers 124 are formed on thehigh-k gate dielectric layers 122 to wraps around the secondsemiconductor layers 208 and fill the remainders of the gaps 214 and thegate trenches 212, in accordance with some embodiments.

FIGS. 9D-1 and 9D-2 are cross-sectional views of a semiconductor devicestructure 21 after the formation of a first dielectric capping layer128A, contact plugs 140, an upper interlayer dielectric layer 142,source/drain vias 144, a gate via 148A, a capacitor 150B, and acapacitor via 149B, in accordance with some embodiments. The first finalgate stack 118A and the second final gate stack 118B are recessed toform a first recess (not shown) over the first final gate stack 118A anda second recess (not shown) over the second final gate stack 118B, inaccordance with some embodiments. A first dielectric capping layer 128Ais formed in the first recess over the first final gate stack 118A, asshown in FIGS. 9D-1 and 9D-2, in accordance with some embodiments. Abottom electrode layer 134B is formed at the bottom of the second recessand a ferroelectric layer 136B is formed over the bottom electrode layer134B in the second recess, in accordance with some embodiments.

Contact plugs 140 are formed through the lower interlayer dielectriclayer 116 and land on the source/drain features 114A and 114B, inaccordance with some embodiments. An upper interlayer dielectric layer142 is formed over the lower interlayer dielectric layer 116, thecontact plugs 140, the first dielectric capping layer 128A, and theferroelectric layer 136B, in accordance with some embodiments.Source/drain vias 144 are formed through the upper interlayer dielectriclayer 142 and land on the contact plugs 140, in accordance with someembodiments. A gate via 148A is formed through the upper interlayerdielectric layer 142 and the first dielectric capping layer 128A andland on the metal gate electrode layer 124 of the first final gate stack118A, thereby forming a GAA FET device 21A in the first region 102A ofthe substrate 102, as shown in FIGS. 9D-1 and 9D-2, in accordance withsome embodiments.

An upper electrode layer 146B and a capacitor via 149B nested within theupper electrode layer 146B are collectively formed through the upperinterlayer dielectric layer 142 and land on the ferroelectric layer136B, thereby forming a FeFET device 21B with GAA design in the secondregion 102B of the substrate 102, as shown in FIGS. 9D-1 and 9D-2, inaccordance with some embodiments. The upper electrode layer 146B, theferroelectric layer 136B and the bottom electrode layer 134B combine toform a capacitor 150B over the transistor 280B, in accordance with someembodiments. The capacitor via 149B is electrically the capacitor 150B,in accordance with some embodiments.

The GAA FET device 21A may be operable as a logic device, a peripherycircuit device, and/or an SRAM device. The FeFET device 21B comprisingthe ferroelectric layer 136B may be operable as a FRAM device due to thedielectric polarization characteristics of the ferroelectric layer 136B.Other conductive features of the multilayer interconnect structure (suchas vias and metal lines within an intermetal dielectric layer over theupper interlayer dielectric layer 142) may be formed over thesemiconductor device structure 21 and electrically coupled to theconductive features of the GAA FET device 21A and the FeFET device 21B.In some embodiments, the GAA FET device 21A is operable to access and/orcontrol the FeFET device 21B (e.g., to perform read/write/eraseoperations) through the multilayer interconnect structure.

The modification described above with respect to FIGS. 4-1 and 4-2 maybe applied to the semiconductor device structure with GAA design. FIGS.10-1 and 10-2 are cross-sectional views of a semiconductor devicestructure 22 with GAA design, in accordance with some embodiments of thedisclosure. FIG. 10-1 is a cross-sectional view in the second region102B corresponding to cross-section X-X of FIG. 8 and FIG. 10-2 is across-sectional view in the second region 102B corresponding tocross-section Y-Y of FIG. 8. The semiconductor device structure 22 ofFIGS. 10-1 and 10-2 is similar to the semiconductor device structure 21of FIGS. 9D-1 and 9D-2 except for the bottom electrode layer not formedbetween the ferroelectric layer 136B and the second final gate stack118B, in accordance with some embodiments. The ferroelectric layer 136Bis formed in direct contact with the second final gate stack 118B,thereby forming a FeFET device 22B in the second region 102B of thesubstrate, in accordance with some embodiments. The metal gate electrodelayer 124 of the second final gate stack 118B is used as the bottomelectrode layer of the capacitor 150B, in accordance with someembodiments.

The modification described above with respect to FIGS. 5A and 5B may beapplied to the semiconductor device structure with GAA design. FIG. 11is a cross-sectional view of a semiconductor device structure 23 withGAA design, in accordance with some embodiments of the disclosure. FIG.11 is a cross-sectional view corresponding to cross-section X-X of FIG.8. The semiconductor device structure 23 of FIG. 11 is similar to thesemiconductor device structure 21 of FIG. 9D-1 except that the firstdielectric capping layer 128A covers the upper surface of the gatespacer layers 113 and the ferroelectric layer 136B covers the uppersurface of the gate spacer layers 113. The first dielectric cappinglayer 128A of a GAA device 23A includes a lower portion between the gatespacer layers 113 and an upper portion over the upper surfaces of thegate spacer layers 113, and the upper portion of the first dielectriccapping layer 128A is wider than the lower portion of the firstdielectric capping layer 128A, in accordance with some embodiments.Similarly, the ferroelectric layer 136B of a FeFET device 23B includes alower portion between the gate spacer layers 113 and an upper portionover the upper surfaces of the gate spacer layers 113, and the upperportion of the ferroelectric layer 136B is wider than the lower portionof the ferroelectric layer 136B, in accordance with some embodiments.

The modification described above with respect to FIGS. 6A-1 through 6D-2may be applied to the semiconductor device structure with GAA design.FIGS. 12-1 and 12-2 are cross-sectional views of a semiconductor devicestructure 24 with GAA design, in accordance with some embodiments of thedisclosure. FIG. 12-1 is a cross-sectional view corresponding tocross-section X-X of FIG. 8 and FIG. 12-2 is a cross-sectional view inthe second region 102B corresponding to cross-section Y-Y of FIG. 8. Thesemiconductor device structure 24 of FIGS. 12-1 and 12-2 is similar tothe semiconductor device structure 21 of FIGS. 9D-1 and 9D-2 except thata capacitor 150B that includes a bottom electrode layer 134B, aferroelectric layer 136B, and a top electrode layer 146B is formed in avia hole, in accordance with some embodiments. A FeFET device 24Bincludes a capacitor 150B, which is formed in the via hole and passesthrough the upper interlayer dielectric layer 142 and the seconddielectric capping layer 128B to the second final gate stack 118B, inaccordance with some embodiments. The sidewall of the top electrodelayer 146B, the sidewall of the ferroelectric layer 136B, and thesidewall of the bottom electrode layer 134B share a continuous surface(i.e., the sidewall of the via hole 152B), in accordance with someembodiments. In some embodiments, the upper surface of the top electrodelayer 146B, the upper surface of the vias 144 and 148A are substantiallycoplanar. In some embodiments, the height of the capacitor 150B issubstantially equal to the height of the gate via 148A.

The modification described above with respect to FIGS. 7A-1 through 7B-2may be applied to the semiconductor device structure with GAA design.FIGS. 13-1 and 13-2 are cross-sectional views of a semiconductor devicestructure 25 with GAA design, in accordance with some embodiments of thedisclosure. FIG. 13-1 is a cross-sectional view corresponding tocross-section X-X of FIG. 8 and FIG. 13-2 is a cross-sectionals view inthe second region 102B corresponding to cross-section Y-Y of FIG. 8. Thesemiconductor device structure 25 of FIGS. 13-1 and 13-2 is similar tothe semiconductor device structure 24 of FIGS. 12D-1 and 12D-2 exceptthat a capacitor via 149B and a capacitor 150B of a FeFET 25B are formedin the same via hole, in accordance with some embodiments. The sidewallof the capacitor via 149B and the sidewall of the capacitor 150Bincluding the top electrode layer 146B, the ferroelectric layer 136B andthe bottom electrode layer 134B share a continuous surface (i.e., thesidewall of the via hole 152B). In some embodiments, the capacitor via149B is shorter than the gate via 148A.

FIGS. 14A-1 through 14B-2 are cross-sectional views illustrating theformation of a semiconductor device structure 26 at various intermediatestages with GAA design, in accordance with some embodiments of thedisclosure. FIGS. 14A-1 and 14B-1 are cross-sectional viewscorresponding to cross-section X-X of FIG. 8 and FIGS. 14A-2 and 14B-2are cross-sectional views in the second region 102B corresponding tocross-section Y-Y of FIG. 8. The second region 102B includes a firstsub-region 102B₁ where a second fin structure 204B₁ is formed and asecond sub-region 102B₂ where a third fin structure 204B₂ is formed, asshown in FIGS. 14A-1 and 14A-2, in accordance with some embodiments.

After the first semiconductor layers 206 are removed to form the gaps214, a channel-cutting process is performed on the semiconductor devicestructure 26, in accordance with some embodiments. The channel-cuttingprocess removes at least one the nanostructure (i.e., the secondsemiconductor layers 208) of the third fin structure 204B₂, inaccordance with some embodiments. The channel-cutting process mayinclude forming a patterned mask layer (such as patterned photoresistlayer) to cover the first region 102A and the first sub-region 102B₁ andperforming an etching process to remove at least one of thesemiconductor layers 208 of the third fin structure 204B₂. Afterward,the patterned mask layer may be removed.

The steps described above with respect to FIGS. 4C-1 through 4D-2 areperformed on the semiconductor device structure 26, thereby forming aGAA device 21A in the first region 102A, a first FeFET device 21B in thefirst sub-region 102B₁ and a second FeFET device 26B in the secondsub-region 102B₂, in accordance with some embodiments. The second FeFETdevice 26B includes a transistor 280B₂ which includes a final gate stack118B₂ wraps around the second semiconductor layer 208 of the third finstructure 204B₂, in accordance with some embodiments. As a result, eachof the FeFET devices 21B and 26B may be formed with the desired numberof the nanostructures by utilizing the channel-cutting process, therebyadjusting the performance, e.g., memory window, of the FeFET devices forperformance demand.

As described above, the embodiments of the present disclosure provide asemiconductor device structure including a FeFET device and a method forforming it. A FeFET device 11B has a CAT design in which a capacitor150B of the FeFET device 11B is integrated into CMOS MEOL processes andformed directly above a gate stack 118B of a transistor 180B. The methodfor forming the FeFET device includes recessing the gate stack 118B toform a recess 126B and forming a ferroelectric layer 136B in the recess126B. Therefore, the endurance and the retention of the FeFET device maybe enhanced, the power consumption the FeFET device may be lowered, anda fabrication process for forming the FeFET device may be achieved.

Embodiments of a semiconductor device structure may be provided. Thesemiconductor device structure may include a ferroelectric layer over agate stack. The ferroelectric layer may be located between upperportions of the gate spacer layers and is connected to the first gatestack. Therefore, the endurance and the retention of the FeFET devicemay be enhanced, the power consumption the FeFET device may be lowered,and a fabrication process for forming the FeFET device may be achieved.

In some embodiments, a semiconductor device structure is provided. Thesemiconductor device structure includes a substrate, a first finstructure over the substrate, and a FeFET device over a first region ofthe substrate. The FeFET includes a first gate stack across the firstfin structure. The semiconductor device structure also includes firstgate spacer layers alongside the first gate stack, and a ferroelectriclayer over the first gate stack. At least a portion of the ferroelectriclayer is located between upper portions of the first gate spacer layersand is adjacent to the first gate stack.

In some embodiments, a semiconductor device structure is provided. Thesemiconductor device structure includes a first set of nanostructuresover a substrate, a first gate stack wrapping around the first set ofnanostructures, a first ferroelectric layer directly above the firstgate stack, an interlayer dielectric layer surrounding the first gatestack and the first ferroelectric layer, and a via through theinterlayer dielectric layer and coupling to the first ferroelectriclayer.

In some embodiments, a method for forming a semiconductor devicestructure is provided. The method includes forming a first gate stackacross a first active region and a second gate stack across a secondactive region, recessing the first gate stack and the second gate stackto form a first recess over the first gate stack and a second recessover the second gate stack, forming a dielectric capping layer in thefirst recess, forming a ferroelectric layer in the second recess,forming an interlayer dielectric layer over the dielectric capping layerand the ferroelectric layer, disposing a first via through theinterlayer dielectric layer and the dielectric capping layer and on thefirst gate stack, and forming a second via through the interlayerdielectric layer and on the ferroelectric layer.

The foregoing outlines features of several embodiments so that thoseskilled in the art may better understand the aspects of the presentdisclosure. Those skilled in the art should appreciate that they mayreadily use the present disclosure as a basis for designing or modifyingother processes and structures for carrying out the same purposes and/orachieving the same advantages of the embodiments introduced herein.Those skilled in the art should also realize that such equivalentconstructions do not depart from the spirit and scope of the presentdisclosure, and that they may make various changes, substitutions, andalterations herein without departing from the spirit and scope of thepresent disclosure.

1-13. (canceled)
 14. A method for forming a semiconductor devicestructure, comprising: forming a first gate stack across a first activeregion and a second gate stack across a second active region; recessingthe first gate stack and the second gate stack to form a first recessover the first gate stack and a second recess over the second gatestack; forming a dielectric capping layer in the first recess; forming aferroelectric layer in the second recess; forming an interlayerdielectric layer over the dielectric capping layer and the ferroelectriclayer; disposing a first via through the interlayer dielectric layer andthe dielectric capping layer and on the first gate stack; and disposinga second via through the interlayer dielectric layer and on theferroelectric layer.
 15. The method for forming the semiconductor devicestructure as claimed in claim 14, further comprising: forming adielectric material in the first recess and the second recess; removinga portion of the dielectric material in the second recess to form thedielectric capping layer in the first recess; forming a ferroelectricmaterial over the dielectric capping layer and in the second recess: andremoving a portion of the ferroelectric material over the dielectriccapping layer to form the ferroelectric layer in the second recess. 16.The method for forming the semiconductor device structure as claimed inclaim 14, further comprising: forming a bottom electrode at a bottom ofthe second recess, wherein the ferroelectric layer is formed over thebottom electrode; forming a via hole through the interlayer dielectriclayer and exposing an upper surface of the ferroelectric layer; andforming a top electrode layer along sidewalls and a bottom surface ofthe via hole, wherein the second via is formed over the top electrodelayer in the via hole.
 17. The method for forming the semiconductordevice structure as claimed in claim 14, wherein the first active regionincludes a fin structure.
 18. The method for forming the semiconductordevice structure as claimed in claim 14, further comprising: forming astack over a substrate, the stack including alternating firstsemiconductor layers and second semiconductor layers; patterning thestack into a first fin structure and a second fin structure; andremoving the first semiconductor layers of the first fin structure andthe first semiconductor layers of the second fin structure, therebyforming the first active region from the second semiconductor layers ofthe first fin structure and the second active region from the secondsemiconductor layers of the second fin structure.
 19. The method forforming the semiconductor device structure as claimed in claim 18,further comprising: removing at least one of the second semiconductorlayers from the second active region after removing the firstsemiconductor layers of the second fin structure.
 20. The method forforming the semiconductor device structure as claimed in claim 14,further comprising: annealing the ferroelectric layer before forming thefirst via and the second via.
 21. A method for forming a semiconductordevice structure, comprising: forming a first gate spacer layer and asecond gate spacer layer over a fin structure; forming a source/drainfeature in the fin structure; forming a first dielectric layer over thesource/drain feature; forming a gate electrode layer over the finstructure between the first gate spacer layer and the second gate spacerlayer; forming a ferroelectric material over the gate electrode layer,the first gate spacer layer, the second gate spacer layer and the firstdielectric layer; removing a portion of the ferroelectric material overthe first dielectric layer until an upper surface of the firstdielectric layer is exposed, wherein a portion of the ferroelectricmaterial over the gate electrode layer forms a ferroelectric layer; andforming a top electrode layer on the ferroelectric layer.
 22. The methodfor forming the semiconductor device structure as claimed in claim 21,further comprising: etching the gate electrode layer, wherein afteretching the gate electrode layer, upper surfaces of the first gatespacer layer and the second gate spacer layer are higher than an uppersurface of the gate electrode layer.
 23. The method for forming thesemiconductor device structure as claimed in claim 22, furthercomprising: etching the first spacer layer and the second gate spacerlayer, wherein after etching the first spacer layer and the second gatespacer layer, the upper surface of the first dielectric layer is higherthan the upper surfaces of the first gate spacer layer and the secondgate spacer layer, and the ferroelectric layer covers the upper surfacesof the first gate spacer layer and the second gate spacer layer.
 24. Themethod for forming the semiconductor device structure as claimed inclaim 21, wherein the ferroelectric layer is in contact with the gateelectrode layer, the first gate spacer layer and the second gate spacerlayer.
 25. The method for forming the semiconductor device structure asclaimed in claim 21, further comprising: forming a bottom electrodematerial along a first sidewall of the first gate spacer layer, a secondsidewall of the second gate spacer layer, and an upper surface of thegate electrode layer; and removing portions of the bottom electrodematerial along the first sidewall of the first gate spacer layer and thesecond sidewall of the second gate spacer layer, wherein a portion ofthe bottom electrode material along the upper surface of the gateelectrode layer forms a bottom electrode layer, and the ferroelectricmaterial is formed over the bottom electrode layer.
 26. The method forforming the semiconductor device structure as claimed in claim 21,further comprising: forming a second dielectric layer over theferroelectric layer; and etching the second dielectric layer to form avia hole exposing the ferroelectric layer, wherein the top electrodelayer is formed in the via hole.
 27. The method for forming thesemiconductor device structure as claimed in claim 26, furthercomprising: forming a via over the top electrode layer in the via hole,wherein the via is nested within the top electrode layer.
 28. The methodfor forming the semiconductor device structure as claimed in claim 21,wherein the ferroelectric material is HfZrO, HfLaO, HfSiO, or HfAlO. 29.A method for forming a semiconductor device structure, comprising:forming a first gate stack surrounding a first active region and asecond gate stack surrounding a second active region; forming a firstdielectric capping layer over the first gate stack and a seconddielectric capping layer over the second gate stack; replacing thesecond dielectric capping layer with a ferroelectric layer; forming afirst via in the first dielectric capping layer and on the first gatestack; and forming a top electrode layer on the ferroelectric layer. 30.The method for forming the semiconductor device structure as claimed inclaim 29, further comprising: forming a lower interlayer dielectriclayer over the first active region and the second active region; etchingthe first gate stack to form a first recess over the first gate stack inthe lower interlayer dielectric layer; etching the second gate stack toform a second recess over the second gate stack in the lower interlayerdielectric layer; forming a dielectric material over the lowerinterlayer dielectric layer and filling the first recess and the secondrecess; and removing a portion of the dielectric material over the lowerinterlayer dielectric layer, wherein a portion of the dielectricmaterial in the first recess forms the first dielectric capping layer,and a portion of the dielectric material in the second recess forms thesecond dielectric capping layer.
 31. The method for forming thesemiconductor device structure as claimed in claim 29, wherein replacingthe second dielectric capping layer with the ferroelectric layercomprises: etching the second dielectric capping layer until the secondgate stack is exposed; forming a ferroelectric material over the firstdielectric capping layer and second gate stack; and removing a portionof the ferroelectric material over the first dielectric capping layer,wherein a portion of the ferroelectric material over the second gatestack forms the ferroelectric layer.
 32. The method for forming thesemiconductor device structure as claimed in claim 29, furthercomprising: forming an upper interlayer dielectric layer over the lowerinterlayer dielectric layer; and etching the upper interlayer dielectricto form a via hole extending through the upper interlayer dielectriclayer and exposing the ferroelectric layer, wherein the top electrodelayer is formed in the via hole and has a U-shape profile.
 33. Themethod for forming the semiconductor device structure as claimed inclaim 29, wherein the first active region comprises a first set ofnanostructures spaced apart from one another and the second activeregion comprises a second set of nanostructures spaced apart from oneanother, and the number of the nanostructures in the first set and thenumber of the nanostructures in the second set are different.